Alumina Ceramic Substrate | Better thermal cycle performance, high cycle times and high reliability. Like the PCB board (or the IMS substrate), it can etch the structure of various patterns; no pollution and no pollution. The thermal expansion coefficient is close to that of silicon, which simplifies the production process of power modules. The tape-cast ceramic substrate has good flatness, smooth surface and good electrical properties; high thermal conductivity, thermal expansion coefficient matching other materials; good mechanical properties; high temperature, high pressure and high stability. It is used in ceramic copper clad laminates, ceramic circuit boards, ceramic heating plates, thick film circuit boards and other products.